Title: Sensor mounting structure with snapping feature
Application Number: 200610141415 Application Date: 2006.09.30
Publication Number: 1940488 Publication Date: 2007.04.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01D11/00
Applicant(s) Name: Rockwell Automation Tech Inc. Address:
Inventor(s) Name:
Attorney & Agent: gujun feng
Abstract:
    Disclosed herein is a sensing device mounting mechanism allowing for a sensing device to be mounted in relation to a supporting structure. The sensing device mounting mechanism comprises a housing portion having a snapping mechanism. The snapping mechanism allows the housing portion to be coupled to at least one of the supporting structure, the sensing device, and an additional portion of the sensing device mounting mechanism.
Time: 8
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