Title: Bonded copper wire and preparing method thereof
Application Number: 200610154487 Application Date: 2006.11.03
Publication Number: 1949493 Publication Date: 2007.04.18
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L23/49;H01B1/02;C22C9/00;B23P23/04;C22C1/03;B21C1/12;B22D11/16;C25C1/12
Applicant(s) Name: Ningbo Kangqiang Electronics Co., Ltd. Address:
Inventor(s) Name: Fang Yuebo;Zheng Zhifa;Zheng Kangding
Attorney & Agent: daizhong jiong
Abstract:
    The invention discloses a bonding copper wire, comprising: Ce 0.0005wt%-0.001wt%, Zn or Sn 0.0003wt%-0.0008wt% and Cu the rest, purity
Time: 14