Title: High temperature copper alloy for lead frame and its making process
Application Number: 200610096471 Application Date: 2006.09.27
Publication Number: 1932056 Publication Date: 2007.03.21
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C22C9/00;C22C1/02;B22D21/00;B21B1/46;B21B37/00;C22C1/03;C22F1/08;H01L23/495;H01L39/12;H01B1/02
Applicant(s) Name: Suzhou Inst. of Non-Ferrous Metal Processing Address:
Inventor(s) Name:
Attorney & Agent: chenzhong hui yaojiao yang
Abstract:
    The present invention provides one kind of copper alloy for high temperature softening resistant lead frame and its making process. The copper alloy contains Fe 2.0-2.6wt %, Zn 0.05-0.1wt %, P 0.01-0.03wt %, Cr 0.01- 0.1wt %, and Re 0.01-1.5wt % except Cu. The making process includes the following steps: smelting in protecting atmosphere, casting and cooling at the speed of 80 deg.c/min between the liquid phase temperature and 400 deg.c; hot rolling the cast blank at 1000 deg.c, repeated cold rolling and double continuous annealing at 400-600 deg.c; cold rolling to reach thickness change over 50 % and final low temperature annealing at temperature below 450 deg.c. The copper alloy has excellent high temperature softening tolerance, high tensile strength, high elongation, high electric conductivity and other features and is excellent material for producing lead frame.
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