Title: Nozzle for supplying treatment liquid and substrate treating apparatus
Application Number: 200610111297 Application Date: 2006.08.21
Publication Number: 1919470 Publication Date: 2007.02.28
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B05B1/14;B08B3/12;C03C17/00
Applicant(s) Name: Tokyo Ohka Kogyo Co., Ltd. Address:
Inventor(s) Name: Shimai Futoshi
Attorney & Agent: xu qian luo yunpo
Abstract:
    A nozzle for supplying a treatment liquid which makes it possible to perform uniform cleaning to a surface of a substrate even in a case where the size of a substrate is large. A slit-shaped ejection hole (14) is formed at the lower end of the nozzle (2) for supplying a treatment liquid. In the nozzle (2), a passage (3) for supplying a treatment liquid which leads to the slit-shaped ejection hole (14) is formed by bonding two nozzle parts (2a, 2b) to each other. Projections (8, 9, 10) are provided on the abutting surface of at least one of the two nozzle parts (2a) so as to divide a treatment liquid flowing downward through the supply passage (3) into left and right.
Time: 18
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