Title: Method and device for cleaning semiconductor crystal wafer
Application Number: 200610096104 Application Date: 2006.09.18
Publication Number: 1941292 Publication Date: 2007.04.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L21/302;H01L21/306;B08B3/00
Applicant(s) Name: Huarunhuajing Microelectronic Co., Ltd., Wuxi Address:
Inventor(s) Name:
Attorney & Agent: yingong mei
Abstract:
    A cleaning method and equipment of semiconductor wafer belongs to the equipment of wet-etching working procedure. The one group of equipment (system) relates to cankerous canal, spray advance washing canal, and stepped high and low rushing canal for the wet-etching, removing glue and cleaning in the process of semiconductor wafer production. Water from one hose cleans two groups of wafer at same time to keep the cleaning of the wafer surface. It reduces the hidden trouble of safety to working procedure and avoids the pollution of water and mark of acid. It changes the influent fashion of primary advance washing canal from bottom to brim of spray one and the water spout into the canal through the hole of the brim. It adds the spouting pressure in concentrated direction and cleans the wafer drastically to improve the wet-etching
Time: 21
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