Title: Wafer array apparatus and method for arraying wafer
Application Number: 200610140234 Application Date: 2006.10.20
Publication Number: 1956161 Publication Date: 2007.05.02
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L21/677;H01L21/67;H01L21/30;H01L21/00;B65G49/00;B65G47/74;B08B11/00;B08B3/04
Applicant(s) Name: K. C. Tech Co., Ltd. Address:
Inventor(s) Name: Kang Byoung Ju;Sohn Young Sung;Cho Hyun Woo;Lee Te
Attorney & Agent: guohong xi liyun xia
Abstract:
    The invention relates to a wafer array apparatus which makes opposite surfaces of a pair of wafer adjacent to each other have a same property during a process for cleaning lots of wafers once by arraying wafers. The wafer array apparatus provided according to the invention, includes a wafer receiving unit for receiving a first wafer group and a second wafer group composed of at least a wafer respectively in a horizontal state and arranging them in a vertical state, and delivering units for receiving the first wafer group and a second wafer group of the vertical state in turn and arranging them, and the wafer array apparatus has a sturcture in which the wafers of the first wafer group and the wafers of the second wafer group are alternately arrayed in opposite directions by the rotation of the wafer receiving unit or one of the delivering units.
Time: 16
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