| Title: | Vacuum drying device and drying method for substrate | ||
| Application Number: | 200610108181 | Application Date: | 2006.07.31 |
| Publication Number: | 1928475 | Publication Date: | 2007.03.14 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | F26B5/04;F26B25/00;B05D3/12 | ||
| Applicant(s) Name: | Dainippon Screen Mfg | Address: | |
| Inventor(s) Name: | |||
| Attorney & Agent: | xushu | ||
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Abstract: |
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| The invention provides a reduced pressure drying apparatus which prevents electrification generated on a substrate and a support surface, even if the substrate is supported in face contact. In the reduced pressure drying apparatus, the substrate is supported in face contact on the entire surface of a lift plate over the entire back side of a product region where a treatment liquid is present, when drying the liquid on the substrate for preventing irregularities in the liquid effectively. Then, after the drying treatment, the reduced pressure state of the atmosphere in the treatment chamber is maintained, and a support pin projects from the upper surface of the lift plate. As a result, the substrate is subjected to point support while the substrate is being separated from a support surface. In this manner, when the substrate is separated from the support surface in the reduced pressure state of the atmosphere, friction hardly occurs on the substrate and the support surface, thus preventing electrification effectively. | |||
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| Time: | 15 | ||
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