Title: Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
Application Number: 200610141435 Application Date: 2006.09.29
Publication Number: 1944557 Publication Date: 2007.04.11
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C09D171/12;D06N3/00;B05D7/04;B32B33/00;B32B37/12;H05K1/02
Applicant(s) Name: Hitachi Chemical Co., Ltd. Address:
Inventor(s) Name: Amou Satoru;Akahoshi Haruo;Nakamura Yoshihiro;Mina
Attorney & Agent: chencuan
Abstract:
    The present invention relates to a low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish. There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 mum.
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