Title: Solution application device and solution application method
Application Number: 200680000429 Application Date: 2006.04.25
Publication Number: 1976761 Publication Date: 2007.06.06
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B05C5/00;G02F1/1333;B05D1/26;G02F1/1368;G02F1/13
Applicant(s) Name: Shibaura Mechatronics Corp. Address:
Inventor(s) Name: Yamazaki Takahiro
Attorney & Agent: hujian xin
Abstract:
    A solution application device for applying solution to a substrate having a recess/ridge pattern (15) where recess/ridge sections are regularly formed. The solution application device is provided with an application head (22) having a nozzle (34) and applying in a dropping manner the solution from the nozzle to the substrate, a placement table (13) for moving the substrate and the application head relative to each other, and a control device (41) for controlling, when the substrate and the application head are moved relative to each other by the placement table, the direction of their relative movement to be displaced by a predetermined angle relative to the direction of arrangement of the recess/ridge sections of the recess/ridge pattern formed on the substrate.
Time: 8
<- Previous Patent:Paste application device and past...   |  Next Patent:Dip-coating assembly line ->