Title: Paste coating device and method for manufacturing sliced electronic component
Application Number: 200610084572 Application Date: 2006.06.02
Publication Number: 1892939 Publication Date: 2007.01.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01G13/00;B05C9/00
Applicant(s) Name: Murata Manufacturing Co. Address:
Inventor(s) Name: Ito Kowashi;Taniguchi Masaaki
Attorney & Agent: fang xiaogong
Abstract:
    The invention provides an apparatus for applying paste, by which paste can be prevented from being stuck/solidified on the side face of a peripheral part of a paste applying wheel and can be applied stably to a chip type component and to provide a method for manufacturing the chip type electronic component. The apparatus for applying paste, which is used for applying the paste packed in a groove arranged on the outer peripheral surface of a paste wheel 12 to the end face of the chip type component 2, is provided with: scraping blades 16 which are arranged respectively on both sides of the paste applying wheel 11 for supplying paste to the paste wheel 12 from a paste vessel 10 and are used for scraping the paste stuck to both side faces of the peripheral part of the paste applying wheel 11; and a regulation blade 13 arranged to be brought into contact with the outer peripheral surface of the paste wheel 12.
Time: 16