Title: Chemical solution application apparatus and chemical solution application method
Application Number: 200610091758 Application Date: 2006.06.12
Publication Number: 1876243 Publication Date: 2006.12.13
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B05C5/00,B05C11/08,B05C11/10,B05D1/40
Applicant(s) Name: Semiconductor Energy Lab Address:
Inventor(s) Name:
Attorney & Agent: xiong yulan zou xuemei
Abstract:
     An object is to provide a chemical solution application apparatus capable of applying a chemical solution evenly and without irregularity by a spin coating method. A plurality of nozzles are provided for applying a chemical solution to an application object that is fixed over a stage. Each of the nozzles is individually mobile in vertical and horizontal directions. For this reason, controlling a discharging point or pattern is possible, and application responding to a wider viscosity range of chemical solutions is possible. By implementing the present invention, a chemical solution application apparatus equipped with a discharging method of a chemical solution by which a coating film having a small film thickness distribution over an entire substrate and an even thickness can be obtained, as well as for which use efficiency is improved by cutting down on waste of a chemical solution to be discharged.
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