Title: Coating film forming method
Application Number: 200610127551 Application Date: 2006.09.12
Publication Number: 1931446 Publication Date: 2007.03.21
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B05C5/02;B05C11/10;C03C17/00
Applicant(s) Name: Tokyo Applied Chemical Industr Address:
Inventor(s) Name:
Attorney & Agent: luoyun po xuqian
Abstract:
    To provide a method for forming a coating film, by which a swell of the coating film can be decreased around an application starting point and the undulation of the whole coating film can also be decreased when a coating liquid (for example, a developer, a cleaning liquid, a SOG solution and a resist liquid) is applied to a substrate. The method for forming the uniform coating film on the surface of the object (1) to be coated from the coating liquid to be supplied from a slit nozzle (2) moving relatively on the surface of the object (1) to be coated comprises the steps of: allowing a coating liquid discharge port (2b) of the slit nozzle (2) to approach the surface of the object (1) to be coated before the application is started; driving a pump (3) for sending the coating liquid; connecting the coating liquid discharge port (2b) to the surface of the object (1) to be coated by the coating liquid; keeping the connected state by the coating liquid for the predetermined time; and starting the application.
Time: 16
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