| Title: | Paste coater and PoP automatic mounting apparatus employing the same | ||
| Application Number: | 200610144669 | Application Date: | 2006.11.14 |
| Publication Number: | 1981941 | Publication Date: | 2007.06.20 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | B05C1/08;B05C13/02;B23K3/08;H01L21/67 | ||
| Applicant(s) Name: | IBM | Address: | |
| Inventor(s) Name: | Kimura Hideo;Yokoue Toshiyuki;Shiota Yasuhiko | ||
| Attorney & Agent: | zhanggao | ||
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Abstract: |
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| A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap. | |||
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| Time: | 10 | ||
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