Title: Single-admission and double-area adjustable nozzle
Application Number: 200510126442 Application Date: 2005.12.09
Publication Number: 1846871 Publication Date: 2006.10.18
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B05B1/14,C23C16/54,C23F4/00,H01L21/3065
Applicant(s) Name: Beijing Beifang Microelectronic Base Equipment Address: 100016
Inventor(s) Name:
Attorney & Agent: wang changfeng
Abstract:
     The single-admission and double-area adjustable nozzle includes one main nozzle body. The main nozzle body is installed via fastener and sealing ring onto medium window, and has adjusting plug, lower downward through holes in the lower surface and downwards tilted through holes arranged on the side walls. By means of regulating the position of the plug inside the main nozzle body, the single-admission and double-area adjustable nozzle has changed inner and outer gas jet area to realize the double gas inlet flow ratio. The present invention is used in etching 12-inch wafer equipment and has lowered cost.
Time: 7
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