Title: Dedicated blade materials for line cutting of semiconductor materials
Application Number: 200610018021 Application Date: 2006.06.27
Publication Number: 1884067 Publication Date: 2006.12.27
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C01B31/36,C04B35/565,C04B35/626,B02C19/00,B02C23/08,B03B5/00
Applicant(s) Name: Henan Xingshi High Address: 450001
Inventor(s) Name: Yang Dongping, Tao Jian
Attorney & Agent: han hua
Abstract:
     The invention discloses a specific cutting knife-material of semiconductor material wire (6H-SiC), which comprises the following steps: 1. grinding through cyclone; grading flow; 2. grading water pretreatment; grading finely for overflow; 3. wetting to blend; dehydrating eccentrically; separating; 5. drying through microwave continuously; 6. blending dryly. The invention is compatible with flexibility of black carbofrax, which improves anti-grinding property obviously.
Time: 7