Title: Anti-electrostatic method of chip device
Application Number: 200510134479 Application Date: 2005.12.15
Publication Number: 1984522 Publication Date: 2007.06.20
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H05F3/02;H05K1/18
Applicant(s) Name: Zhongxing Communication Co., Ltd. Address:
Inventor(s) Name: Zhu Songlin
Attorney & Agent: xuzhi yong yantao
Abstract:
    The first method of the invention is: for a chip connected to circuit board and having a heat-sink, electrically connecting the heat-sink to the ground of the circuit board. The second method of the invention is: mounting a heat-sink on the chip, and then connecting the heat-sink to the ground of the circuit board. The heat-sink is located on the chip and encapsulates the chip, and is connected to the ground through the protected ground or through working ground. When the chip is located in the center of the circuit board, the heat-sink is grounded through working ground; when the chip is located at edge of the circuit board, it is grounded through protected ground.
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