| Title: | Macromolecular ESD protective component and its manufacturing method | ||
| Application Number: | 200510112428 | Application Date: | 2005.12.30 |
| Publication Number: | 1805649 | Publication Date: | 2006.07.19 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | H05F3/02,H01L23/60 | ||
| Applicant(s) Name: | Shanghai Wayon Thermo-Electro Materials Co., Ltd. | Address: | 201206 |
| Inventor(s) Name: | Lian Tiejun, Hu Xiaowen, Hou Liming, Cheng Zhen, W | ||
| Attorney & Agent: | dong mei | ||
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Abstract: |
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| The invention relates to a macromolecule base ESD protective element, relative producing method, which provides an electric element that using the macromolecule resin as base, the mixed compound material of conductor/semi-conductor/insulator particle as stuffing as main raw material. The inventive macromolecule base ESD protective element is formed by the core material and the metallic foils adhered on the two side of core material, which uses the heat plastic macromolecule material as basic material, while the macromolecule polymer is 25-45%, the conductive particle is 15-40%, the semi-conductor particle is 15-35%, the insulator particle is 0-15% and the processing agent is 0.1-10%, to be mixed to attain the core material. Wherein, said heat plastic macromolecule material is one or the mixture of polythene, polypropylene, polyvinyl chloride and polyvinyl fluoride polymer. The invention has simple process, and since it uses the radiation method to process cross-linking; the processed chips in early stage can be kept easily. | |||
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| Time: | 18 | ||
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