Title: Interference resistance snap
Application Number: 200520045324 Application Date: 2005.09.27
Publication Number: 000000000 Publication Date:
Approval Pub. Date: 2006.10.25 Granted Pub. Date: 2006.10.25
International Classifi-cation: H05K9/00
Applicant(s) Name: Huanda Computer (Shanghai) Co., Ltd. Address:
Inventor(s) Name: Lin Qiren
Attorney & Agent: di hu
Abstract:
    An interference resistance snap comprises the upper solder side of the peace surface and the lower solder side of the peace surface, and also comprises a closing structured arc joint face connected the up and down of the solder side. Because the closed structure is formed by connecting the up and down solder side by the arc joint face, other elements are not drawn during the use process. Meanwhile, the arc joint face is stressed uniform, so the status of elastic trip breaking because of concentration of the stress can not happen.
Time: 10