Title: Structure capable of making intelligent mobile phone to reduce thickness
Application Number: 200520039436 Application Date: 2005.02.01
Publication Number: 000000000 Publication Date:
Approval Pub. Date: 2006.03.29 Granted Pub. Date: 2006.03.29
International Classifi-cation: H04M1/02;H05K7/00
Applicant(s) Name: Shanghai Huanda Computer Technology Co., Ltd. Address:
Inventor(s) Name: Lin Chuanzong
Attorney & Agent:
Abstract:
    The utility model concerns a structure capable of making intelligent mobile phone to reduce thickness, and the structure is equipped a thin thickness flexible circuit board and a common circuit board in the mainframe of the mobile phone, of which the electronic element on the flexible circuit board is electrically connected to the electronic element on the common circuit board, and connected to the electric phase of the screen circuit board of the mobile phone, and a rigid colloid is covered on the surface of the flexible circuit board, and the colloid covers all electronic elements on the flexible circuit board. The flexible circuit board locates a side edge on the inner flange of the mobile phone keystroke, when the mobile phone is used, the mobile phone keystroke is pressed, which can be offset by the rigid colloid, avoiding the flexible circuit board deforming, thus, the integral thickness of the mobile phone can be greatly decreased by penetrating the thin thickness flexible circuit board, obtaining the aim of convenient for carrying.
Time: 9
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