Title: Locally stiffened flexible circuit board
Application Number: 200520035856 Application Date: 2005.10.18
Publication Number: 000000000 Publication Date:
Approval Pub. Date: 2007.01.10 Granted Pub. Date: 2007.01.10
International Classifi-cation: H05K1/02;H05K1/18
Applicant(s) Name: BYD Co., Ltd. Address:
Inventor(s) Name: Wang Youren
Attorney & Agent: jiang yaochun
Abstract:
    The utility model discloses a partially stiffed flexible circuit board, which is equipped with a square flat encapsulated chip, a connector, a reinforcement plate and an adhesive layer. The reinforcement plate is fixed at the back side of the flexible circuit board which is opposite to the connector in the square flat encapsulated chip via the adhesive layer. The thickness of the reinforcement plate and the adhesive layer is smaller than or equal to 0.2mm. In this way, no dynamic bending causes to the circuit boards in inserting or pulling out the connectors, which hence avoids fracture of the circuit thereon and improves dependability of the whole circuit board.
Time: 9
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