Title: A liquid-cooled device for CPU with heat pipe in rows
Application Number: 200520015710 Application Date: 2005.04.26
Publication Number: 000000000 Publication Date:
Approval Pub. Date: 2006.08.30 Granted Pub. Date: 2006.08.30
International Classifi-cation: H01L23/427;G06F1/20;H05K7/20
Applicant(s) Name: Beijing University Of Technology Address:
Inventor(s) Name: Li Desheng;Han Ailong
Attorney & Agent: zhang hui
Abstract:
    A liquid-cooled device for CPU with heat pipe in rows belongs to heat exchange technique field. In the device, the boiling pool is a rectangular parallelepiped provided with a groove, and the one-piece component interlinked of the row type heat pipe cooling plate and locking auxiliary device is installed on the boiling pool and it makes up a heat emitter with sealed surrounding. The heat emitter makes the outer bottom surface of the boiling pool closely contact with the CPU through a circlip and the heat emitter is fixed on the CPU. The boiling pool is equipped with low-boiling cooling liquid. The device makes use of gravity heat-tube principle to work. When the computer works, the temperature of the CPU increases and the cooling fluid inside the boiling pool conducts heat exchange with the CPU, making the temperature of the cooling fluid increases until boils into gas, therefore it carries away the heat produced. The boiled gas rises up to the row type heat pipe cooling plate to conduct thermolysis; the gas condenses into liquid after conducting heat exchange with the exterior cold air; the liquid after thermolysis flows back to the boiling pool to accomplish a circulation. The device is provided with the features of low noise, safety, no energy consumption, good chilling effect and low cost.
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