Title: Vertical heat sink
Application Number: 200520012094 Application Date: 2005.04.05
Publication Number: 000000000 Publication Date:
Approval Pub. Date: 2006.05.31 Granted Pub. Date: 2006.05.31
International Classifi-cation: H05K7/20;G12B15/00;G06F1/20
Applicant(s) Name: Cooler Master Co., Ltd. Address:
Inventor(s) Name: Guo Mingjian;Lin Jiayu
Attorney & Agent: sun haochen
Abstract:
    The vertical heat sink includes a heat conducting plate and a radiation device. A lateral direction upper flow channel and a lower flow channel are formed inside the heat conducting plate. One end of each flow channel is an open end which connects to outside. Multiple vertically arranged lengthways paths are formed between the two flow channels. Each path connects to the upper flow channel and lower flow channel. Inside of the lower flow channel is filled with a kind of liquid. The radiation device is connected between the open ends of the upper and lower flow channels by a group of connecting tubes. When the vertical heat sink is installed at a vertical electronic device, the heat conducting plate sends out high heat from the electronic device. And then make use of the inner liquid which can quickly absorb high heat and transfer it to the radiation device. Finally, heat is emitted by the radiation device. So, the electronic device can normally work under a safe temperature.
Time: 6
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