Title: Manufacturing method for electronic controller
Application Number: 200510135056 Application Date: 2005.12.23
Publication Number: 1832665 Publication Date: 2006.09.13
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H05K3/34,H01L21/60
Applicant(s) Name: Matsushita Electric Ind Co., Ltd. Address:
Inventor(s) Name: Nakamoto Yoshinao, Hoshiba Hideji
Attorney & Agent: long chun
Abstract:
     The objective of the invention is to make the reduction of the soldering failure by decreasing the solder amount used for small pitch components and the ensuring of the bonding strength by increasing the solder amount used for lead components compatible. In order to increase the solder amount for bonding a large lead component 11, after a temporary fixing bond 16 for a chip component 14 is applied in the vicinity of the lands 12 of the large lead component 11, flow soldering of a printed wiring board 13 is carried out. Upon the flow soldering, as the temporary fixing bond 16 serves as a barrier, the solder amount for fixing can be increased. Further, as to other location where the temporary fixing bond is not applied, the solder amount for fixing is determined by the flow angles 18, 19 of proper melted solder so that the reduction of the soldering failure by decreasing the solder amount used for the small pitch components can be made compatible with it.
Time: 11