Title: Polycrystal silicon vibration film silicon micro capacitor microphone chip and its preparing method
Application Number: 200510068006 Application Date: 2005.04.30
Publication Number: 1859815 Publication Date: 2006.11.08
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H04R19/04,H04R31/00
Applicant(s) Name: Inst. of Acoustics, CAS Address: 100080
Inventor(s) Name: Qiao Donghai, Hu Wei, Tian Jing, Xu Lian
Attorney & Agent: gao cunxiu
Abstract:
     The present invention discloses polysilicon vibration membrane silicon micro-condenser microphone chip and preparation method. Said silicon micro-condenser microphone chip includes polysilicon vibration membrane , protective layer, isolating layer, air gap, silicon chip and punching backboard, said punching backboard including one doping layer and having plurality of acoustic holes, said acoustic hole formed by etching one continuous doping layer. Said preparation method includes forming one continuous doping layer on said silicon chip upper surface, said doping layer forming at least a part of punching backboard of silicon micro-condenser microphone chip, from said continuous doping layer upper surface down etching out plurality of acoustic hole formed acoustic hole pattern. The present invention adopts polysilicon as vibrating membrane, making completely compatibility with plane semiconductor technology.
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