Title: Power source method for ultra high power pulse non balancing megnetron sputtering
Application Number: 200610134219 Application Date: 2006.11.06
Publication Number: 1948547 Publication Date: 2007.04.18
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C23C14/35;H03K3/00
Applicant(s) Name: Dalian Univ. of Technology Address:
Inventor(s) Name: Mou Zongxin;Wang Zhenwei;Jia Li;Li Guoqing;Zhao Hu
Attorney & Agent: houmeng yuan libao yuan
Abstract:
    The invention discloses a power method for non-equilibrium magnetron spattering with ultra high power, which is mainly used in technique field of surfacial project. It is characterized in that: Ball-tie switching group and impulse are applied to form winding control and high-power pulsed discharge, which can realize spattering deposit of non-equilibrium magnetron spattering with ultra high power. Main power system is used to supply winding and ball-tie switching group with multiplex pulse, to supply non-equilibrium magnetron spattering target with high-power pulse, which can realize extended output. At the same time, intelligent control of microcomputer and continuously-variable of frequency parameter are realized to prevent damage of overflowing, overpressure and overheat. The invention has much strongpoint including simple power structure, stable power, convenient control, high efficiency, shockproof, wide range of parameter adjusting and expandable discharge system, which can improve plasma leaving rate in film depositing to enhance bond strength of film and base and guarantee depositing craft.
Time: 9
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