Title: Electronic component
Application Number: 200610143694 Application Date: 2006.11.08
Publication Number: 1963963 Publication Date: 2007.05.16
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01G4/30;H01G4/40;H03H7/00
Applicant(s) Name: Fujitsu Ltd. Address:
Inventor(s) Name: Matsumoto Tsuyoshi;Mizuno Yoshihiro;Mi Xiaoyu;Okud
Attorney & Agent: zhanglong bu
Abstract:
    An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 mum in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.
Time: 12
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