Title: Surface acoustic wave device and manufacturing method thereof
Application Number: 200610121310 Application Date: 2006.08.22
Publication Number: 1921302 Publication Date: 2007.02.28
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H03H9/25;H03H3/08
Applicant(s) Name: Kyocera Corp. Address:
Inventor(s) Name: Obara Ikuo;Nagamine Shigehiko;IIoka Kiyohiro
Attorney & Agent: zhu jingui
Abstract:
    A surface acoustic wave device includes an excitation electrode formed on a piezoelectric substrate and a binding electrode to be connected with a mounting substrate. The binding electrode is provided with a lower electrode formed on the piezoelectric substrate and an intermediate layer that is made of an adhesion electrode layer and a barrier metal electrode layer. The barrier metal electrode layer includes at least one impurity-containing layer. The binding electrode represents an annular electrode formed to surround the excitation electrode and a wiring electrode connected to the excitation electrode. A surface of at least one of the piezoelectric substrate, the lower electrode and the barrier metal electrode layer is bombarded to make it a rough surface. As a result, a warp due to a film stress caused in each of the layers can be suppressed.
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