Title: Method for manufacturing a piezoelectric vibration device
Application Number: 200610100270 Application Date: 2006.07.06
Publication Number: 1893266 Publication Date: 2007.01.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H03H3/02;H03H9/13;H03H9/15;H01L41/22
Applicant(s) Name: Seiko Epson Corp. Address:
Inventor(s) Name: Aoki Shinya
Attorney & Agent: huang lunwei
Abstract:
    A method of manufacturing a piezoelectric vibrating device. The object of the invention is to provide a method of manufacturing a piezoelectric vibrating device which is capable of improving the reliability of airtightness inside a sealed member, and of a conduction between an extraction electrode and an external electrode without causing a short circuit to the extraction electrode and the metal of an anode joint. As a solution, a junction electrode 25 and an extraction electrode 23 are connected together with an inter-electrode joint 27, the junction electrode 25 and a peripheral glass film 33 are bonded together by anodic bonding, the extraction electrode 23 and a through-hole glass film 34 are bonded together by anodic bonding, and the inter-electrode joint 27 is cut off after an anodic bonding step is finished.
Time: 11
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