| Title: | High-frequency power amplifier and communication apparatus | ||
| Application Number: | 200510059148 | Application Date: | 2005.03.21 |
| Publication Number: | 1671043 | Publication Date: | 2005.09.21 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | H03F1/30,H03F3/20,H03G3/20,H04B1/00 | ||
| Applicant(s) Name: | Matsushita Electric Ind Co., Ltd. | Address: | |
| Inventor(s) Name: | Maya Oki | ||
| Attorney & Agent: | wang yang | ||
|
|
|
||
Abstract: |
|||
| A temperature compensation circuit 145 included in a collector voltage generation section 130 a applies an offset voltage Vofs(T) to a power control signal Vctrl according to a device temperature. The resulting temperature compensation circuit output voltage Vctrl' (T) is applied to a collector terminal of a bipolar transistor 110 through a voltage regulator 140 and a choke inductor 170. | |||
|
|
|||
| Time: | 10 | ||
<- Previous Patent:Method and system for ensuring au...
| Next Patent:Device for controlling horn sound... ->
|
|||