Title: Package for electronic device and method for manufacturing electronic device
Application Number: 200610095780 Application Date: 2006.07.04
Publication Number: 1893036 Publication Date: 2007.01.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L23/02;H01L23/498;H01L21/02;H01L21/48;H03B5/02;H03H9/02
Applicant(s) Name: Seiko Epson Corp. Address:
Inventor(s) Name: Sato Takashi
Attorney & Agent: huang lunwei
Abstract:
    To provide a package for providing a versatility to a package for an electronic device comprising external terminals other than mounting terminals. The package for solving the problem to be solved is a package for the electronic device having the external terminal other than the external terminal 26 for mounting; and arranges an internal terminal 18e electrically connected to the external terminal other than the external terminal 26, and an internal terminal 18d connected to an external terminal 26d for ground connection selectively connected to the internal terminal 18e in a package 10. In the package 10 like this constitution, it is recommendable to set an external terminal other than the external terminal 26 for mounting to a lid 14.
Time: 13
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