Title: Circuit substrate structure and circuit apparatus
Application Number: 200610004551 Application Date: 2006.01.27
Publication Number: 1825579 Publication Date: 2006.08.30
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L23/488,H05K1/16,H03B5/12
Applicant(s) Name: Sanyo Electric Corp. Address:
Inventor(s) Name: Imaoka Toshikazu, Sawai Tetsuro, Saita Atsushi, Ya
Attorney & Agent: li guiliang yang wu
Abstract:
     A circuit substrate structure, wherein a first wiring layer is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: abridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.
Time: 11
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