Title: Printing circuit board
Application Number: 200510101029 Application Date: 2005.11.04
Publication Number: 1960600 Publication Date: 2007.05.09
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H05K1/18;H03B5/32;H03B5/04
Applicant(s) Name: Hongfujin Precision Ind (Shenzhen) Co., Ltd. Address:
Inventor(s) Name: Zhang Haiyun
Attorney & Agent:
Abstract:
    The invention comprises: a signal layer, a power layer located under the signal layer and a ground layer. There is a crystal oscillator, a bonding pad of clock generator and two bounding pads of capacitor on the signal layer; two signal lines connect the bonding pad of crystal oscillator to the bonding pad of clock generator, and also connect the bonding pad of crystal oscillator to the two bonding pads of capacitor; the power layer is partitioned into two regions with different voltages by a power partitioning line located at one side of the bonding pad of crystal oscillator and the bounding pad of clock generator.
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