| Title: | Temperature compensation oscillator and method of manufacturing same | ||
| Application Number: | 200510114519 | Application Date: | 2005.10.24 |
| Publication Number: | 1855710 | Publication Date: | 2006.11.01 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | H03H9/02,H03H9/08,H03B5/04,H03B5/30 | ||
| Applicant(s) Name: | Samsung Electric Mech | Address: | |
| Inventor(s) Name: | |||
| Attorney & Agent: | li wei | ||
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Abstract: |
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| The invention discloses a temperature compensating oscillator and preparing method, which comprises the following steps: loading IC chip with oscillating part and temperature compensating part in the packing case; recording common value of recorded temperature compensating data on the reserving part of temperature compensating part; loading piezoelectric element in the packing case; sealing the case. | |||
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| Time: | 12 | ||
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