Title: Epoxy resin adhesive composition and optical semiconductor adhesive adopting same
Application Number: 200610150389 Application Date: 2006.10.30
Publication Number: 1962798 Publication Date: 2007.05.16
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C09J163/00;H01L33/00;H01S5/00
Applicant(s) Name: Sumitomo Metal Mining Co., Ltd. Address:
Inventor(s) Name: Tanaka Masashi
Attorney & Agent: liuji yang
Abstract:
    The present invention relates to an epoxy resin bonded compound and an optical semiconductor binding agent thereof. The combination can restrain the short wavelength absorptivity, has excellent ultraviolet resistance, weathering resistance, light permeability and storage stability, which is used in the semiconductor device full of optical semiconductor chip and bonding of a variety of parts and has excellent coating character and transmission capacity for the wavelength emergent from the optical semiconductor. Provided is a epoxy resin bonded compound which has an alicyclic ring type epoxide (A), a silicane compound (B) for the hydrolysis group connected to the silicon atom, a 2-valent organo-tin compound (c1), a 4-valent organo-tin compound (c2) and the an inorganic filler (D) with light permeability as the required component, characterized in that, based on the gross of the combination, the content of each component is: (A) is 30-95%, (B) is 0.1-15%, (c1) 0.01-5%, (c2) 0.01-5% and (D) 0.1-50%.
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