Title: Substrate structure, substrate manufacturing method and electronic device
Application Number: 200610171114 Application Date: 2006.12.22
Publication Number: 1988756 Publication Date: 2007.06.27
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H05K1/02;H05K3/34;H01R12/00
Applicant(s) Name: Toshiba K. K. Address:
Inventor(s) Name: Mori Tokihiko;Makita Sadao
Attorney & Agent: chaiyi min
Abstract:
    According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.
Time: 17