Title: Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
Application Number: 200610154048 Application Date: 2006.09.20
Publication Number: 1937225 Publication Date: 2007.03.28
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L27/04;H01L23/02;H01L23/488;H01Q1/36
Applicant(s) Name: IBM Address:
Inventor(s) Name:
Attorney & Agent: wangyong gang
Abstract:
    Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.
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