| Title: | Differential transmission line structure and wiring substrate | ||
| Application Number: | 200610167458 | Application Date: | 2006.12.20 |
| Publication Number: | 1988249 | Publication Date: | 2007.06.27 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | H01P3/08;H05K1/11;H05K1/02 | ||
| Applicant(s) Name: | Shinko Electric Ind Co. | Address: | |
| Inventor(s) Name: | Higuchi Tsutomu | ||
| Attorney & Agent: | chenyuan zhangtian shu | ||
|
|
|
||
Abstract: |
|||
| A differential transmission line structure comprises an insulating layer, a grounded conductive layer laminated to the insulating layer, and a differential transmission line formed in the insulating layer. A region in which the conductive layer is removed is formed in correspondence with a position of the differential transmission line. | |||
|
|
|||
| Time: | 7 | ||
<- Previous Patent:Coaxial characteristic-impedance ...
| Next Patent:Laminated filter based on MEMS te... ->
|
|||