Title: H surface substrate integrated waveguide ring-shape bridge
Application Number: 200610098031 Application Date: 2006.11.28
Publication Number: 1976115 Publication Date: 2007.06.06
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01P1/38;H01P1/39
Applicant(s) Name: Dongnan Univ. Address:
Inventor(s) Name: Zhang Yulin;Hong Wei;Wu Ke;Yan Li
Attorney & Agent: luzhi bin
Abstract:
    A ring type of bridge with waveguide integrated by H numbers of substrate is prepared as forming a ring waveguide structure by metalized through-holes being arranged in coaxial circle way, setting same-phase input end and reverse-phase input end as well as two output ends on ring waveguide structure, arranging metalized through-holes on media substrate coated with metal foil on both surfaces, enabling to use SIW as lead out arm of port for connecting said bridge to SIW components such as SIW antenna.
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