Title: Thick film conductor composition, and its use in ltcc circuit and device
Application Number: 200610077666 Application Date: 2006.04.25
Publication Number: 1913044 Publication Date: 2007.02.14
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01B1/20;H05K1/09;H05K3/46;C04B35/00;H01P1/00;H01P3/00;H01L21/82;H01L23/66
Applicant(s) Name: Du Pont Address:
Inventor(s) Name: Nair Kumaran Manikantan;Mccombs Mark F.
Attorney & Agent: xu xun
Abstract:
    The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions. The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
Time: 13
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