Title: Circuitry module
Application Number: 200680000137 Application Date: 2006.03.13
Publication Number: 1969423 Publication Date: 2007.05.23
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01P3/08;H01P5/18;H01P5/12
Applicant(s) Name: Merrimac Ind Inc. Address:
Inventor(s) Name: Logothetis James J.
Attorney & Agent: chenbin
Abstract:
    A circuit assembly includes multiple substrate with a regions of embedded signal processing circuitry can be connected to a region of adjustable signal processing circuitry and a cavity formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are connected to the embedded signal processing circuitry and/or to the customizable circuitry and enables the addition of a circuit element to the assembly after the bonding of the substrate layers and enables the connection of that added element to the signal processing circuitry and to the adjustable rocessin circuitry.
Time: 9
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