Title: Process and apparatus for etching semiconductor wafers
Application Number: 94190776 Application Date: 1994.10.11
Publication Number: 1115588 Publication Date: 1996.01.24
Approval Pub. Date: 1999.05.05 Granted Pub. Date: 1999.05.05
International Classifi-cation: B44C1/22;H01L21/306
Applicant(s) Name: MEMC Electronic Materials, Inc. Address:
Inventor(s) Name: Henry F. Erk;Roland R. Vandamme
Attorney & Agent: ZHANG ZUCHANG
Abstract:
    Process for etching a semiconductor wafer which includes the steps of rotating the wafer, and contacting the rotating wafer with a flowing froth, the froth being formed, at least in part, by the effervescence of a pressurized etchant containing a dissolved gas.
Time: 10