Title: Semiconductor diode consisting of groove form casing component and packaging method
Application Number: 95108805 Application Date: 1995.08.28
Publication Number: 1144403 Publication Date: 1997.03.05
Approval Pub. Date: Granted Pub. Date: 1999.04.28
International Classifi-cation: H01L21/56,H01L23/02,H01L23/28,H01L29/861
Applicant(s) Name: Dai Chaozhi Address:
Inventor(s) Name:
Attorney & Agent: MU KUILIANG
Abstract:
     The semiconductor diode includes chip, shell and conductor. Said chip is silicon rectifier diode, voltage regulator diode or signal switch diode, and its structure is made up in the form of that its section is sealed and electrodes are equipped with soldering tin or in the form of slice which is not passed through etch-grinding treatment. Said conductor is made of nickel-plated or nickel/silver-plated sheet copper through die-stamping-forming treatment, and is comprised of two pin-type terminals, bottom electrode plate, insulated cut hole, connecting web, crossover electrode and positioning hole, and its sheel is made of aluminium sheet covered with expoxy resin in the form of continuous strip through extrusion-forming procedure, and its bottom is made up in the form of radiation fin.
Time: 10