Title: Semiconductor device structure
Application Number: 95117176 Application Date: 1995.08.30
Publication Number: 1127429 Publication Date: 1996.07.24
Approval Pub. Date: 2001.10.17 Granted Pub. Date: 2001.10.17
International Classifi-cation: H01L21/50;H01L21/70;H01L23/495;H01L23/50
Applicant(s) Name: Hitachi, Ltd. Address:
Inventor(s) Name: Ichiro Miyano;Ikuo Kawaguchi;Kunio Matsumoto
Attorney & Agent: YE KAIDONG XIAO JUCHANG
Abstract:
    An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding harmful light beams, or a positioning base for mounting a substrate.
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