Title: Plasma treating device
Application Number: 95115736 Application Date: 1995.09.13
Publication Number: 1132930 Publication Date: 1996.10.08
Approval Pub. Date: 2001.12.19 Granted Pub. Date: 2001.12.19
International Classifi-cation: H01J37/32;H01L21/3065;H05H1/24
Applicant(s) Name: Matsushita Electric Industrial Co., Ltd. Address:
Inventor(s) Name: Okumura Tomohiro;Nakayama Ichiro;Yanagi Yoshihiro
Attorney & Agent: SHEN ZHAOKUN
Abstract:
    A plasma processing apparatus includes a vacuum vessel, a substrate electrode, a discharge coil, a high frequency power source, and a matching circuit that is connected to the discharge coil by way of a conductor wire and connected to the high frequency power source via a connection cable. Plasma is generated inside the vacuum vessel upon application of a high frequency voltage to the discharge coil so as to process a substrate disposed on the substrate electrode. The invention is characterized in that said discharge coil is partially or wholly made to have a multiple spiral or helical configuration, the deteriorating in power efficiency due to a matching parallel coil of a discharge coil matching circuit and the temperature rise can be minished.
Time: 9