Title: Polishing method and device
Application Number: 03149104 Application Date: 1995.09.13
Publication Number: 1516247 Publication Date: 2004.07.28
Approval Pub. Date: 2007.03.07 Granted Pub. Date: 2007.03.07
International Classifi-cation: H01L21/304;B24B1/00
Applicant(s) Name: Hitachi, Ltd. Address:
Inventor(s) Name: Moriyama Shigeo;Yamaguchi Katsuhiko;Honma Kio
Attorney & Agent: zhu deqiang
Abstract:
    The invention relates to a polishing method and device, adopting the mill stone including abrasive particles and bonding resin bonded with the abrasive particles. It uses the bonding resin to obtain the mill stone with the needed elastic modulus. It uses the mill stone to make the substrate surface smooth and uniform. In addition, firstly using the small elastic modulus polishing tool to polish the substrate, and then using the large one for polishing to obtain the damage-reduced polished surface.
Time: 8