| Title: | Manufacturing method of semiconductor device | ||
| Application Number: | 200410097810 | Application Date: | 1995.09.15 |
| Publication Number: | 1619771 | Publication Date: | 2005.05.25 |
| Approval Pub. Date: | 2007.06.06 | Granted Pub. Date: | 2007.06.06 |
| International Classifi-cation: | H01L21/00;H01L21/20;G02F1/136 | ||
| Applicant(s) Name: | Semiconductor Energy Lab | Address: | |
| Inventor(s) Name: | Shunpei Yamazaki;Naoudo Kusumoto;Satoshi Teramoto | ||
| Attorney & Agent: | liang yong | ||
|
|
|
||
Abstract: |
|||
| In a producing a thin film transistor, a solution containing a metal element for promoting crystallization of silicon is added in contact with an amorphous silicon film, and then a silicide layer is formed by heating process. Further, after a region as crystal growth nucleus is formed by patterning the silicide layer, laser light is irradiated while heating process. As a result, crystal-growth is performed from the region as crystal growth nucleus in the amorphous silicon film, thereby to form monodomain regions corresponding to a single crystal. Also, before the solution is added, the amorphous silicon film may be subjected to plasma treatment. | |||
|
|
|||
| Time: | 15 | ||
<- Previous Patent:Method of manufacturing semicondu...
| Next Patent:Method of fabricating semiconduct... ->
|
|||