Title: Structure and production of silicone semiconductor diode and chip and their insulator
Application Number: 95116287 Application Date: 1995.09.18
Publication Number: 1146073 Publication Date: 1997.03.26
Approval Pub. Date: Granted Pub. Date: 2000.04.19
International Classifi-cation: H01L29/861
Applicant(s) Name: Dai Chaozhi Address:
Inventor(s) Name:
Attorney & Agent: WANG YIPING
Abstract:
     The connected diode insulator component is suitable for the mass prodn and assembly of devices and modules. Each unit in the component is provided with one or several chip mounts, on which diode chips are binded with binder. The said method can produce diodes with excellent property massively and in low cost. The chip of diode and module and the insulator of the present invention have directly-combined structure with chip and insulator being main structure parts.
Time: 12