Title: Connecting method of filament with lead-out wire
Application Number: 93104851 Application Date: 1993.05.15
Publication Number: 1082250 Publication Date: 1994.02.16
Approval Pub. Date: Granted Pub. Date: 1996.03.20
International Classifi-cation: H01J9/02,H01J9/24,H01J61/36,H01K1/18,H01K1/40,H01K3/06
Applicant(s) Name: Beijing Electronic Tube Factory Address: 100016
Inventor(s) Name:
Attorney & Agent:
Abstract:
     Connection of filament with lead-out wire belongs to electric light source assembling, in which, filament, lead-out wire and glass ball are used. Said lead-out wire may be dumet wire whose surficial borate layer at end is removely or wholely, or compound metal wire plated with metals, (Ni,Ag) or their alloy (Ag-Cu). It features simple structure and technology, and better electric conductivity, weldability and air tightness.
Time: 13
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