| Title: | Process of low temp. self-catalytic nikel-plating and copper-plating of insulating ceramic sleeves | ||
| Application Number: | 85102168 | Application Date: | 1985.04.01 |
| Publication Number: | 1003318 | Publication Date: | 1986.09.17 |
| Approval Pub. Date: | Granted Pub. Date: | 1987.12.16 | |
| International Classifi-cation: | C23C18/16,H01G13/00 | ||
| Applicant(s) Name: | Shanxi Normal Univ. | Address: | |
| Inventor(s) Name: | |||
| Attorney & Agent: | FAN SUOQIANG | ||
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Abstract: |
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| The purpose of this invention is to furnish a method for metallizing insulating ceramic sleeve by self-catalytic nickel-plating or copper-plating under low temperature after pretreatment the sleeve. By this method, a lot of expensive silver can be saved by replacing it with nickel or copper instead, meanwhile, the plated film is dense and uniform, wear-resistant, strongly adhering to ceramics and is easy to be welded. The productivity can be increased as much 31 times, the material cost is only 5% of that of silver-plating, the plating needs no or a small amount of heat, so energy consumption can be reduced greatly. | |||
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| Time: | 16 | ||
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