| Title: | Film with high dielectric constant and low dielectric loss | ||
| Application Number: | 90102967 | Application Date: | 1990.10.22 |
| Publication Number: | 1050462 | Publication Date: | 1991.04.03 |
| Approval Pub. Date: | Granted Pub. Date: | 1993.01.27 | |
| International Classifi-cation: | H01B3/28,H01B3/30,H01G4/20 | ||
| Applicant(s) Name: | Tongji Univ | Address: | 200092 |
| Inventor(s) Name: | Chen Jiahua | ||
| Attorney & Agent: | CHEN LONGMEI CHEN SHUDE | ||
|
|
|
||
Abstract: |
|||
| This invention relates to a film of macromolecular polymer polyblend, used for making capacitor and insulating materials. This polyblend is made up of polypropylene and chemigum (nitrile content is 26-35%) by fully mixing in a mixer-refiner. The obtained polyblend can be made into this film meeting various specifications through such steps as breaking, moulding or extruded-calendering, and bidirectional drawing. It features high dielectric constant greater than 4.21, low dielectric loss less than 3 x10 to the power -3, and better processing performance. The capacitor made from this film has a volume decreased by 54%. | |||
|
|
|||
| Time: | 14 | ||
<- Previous Patent:Absolute pressure compensation me...
| Next Patent:Composite electric part of stacke... ->
|
|||